In this study, metal foam heat sinks (MFHS) are proposed for thermal management of electronic devices. Metal foams are excellent candidates for improving the heat transfer performance of heat sinks due to their unique characteristics such as the large surface area to volume ratio and their complex form, which favors mixing and convection. Numerical investigations of the transient thermal-hydraulic behavior and performance of the cooling process of electronic devices by MFHS are carried out. The physical model consists of a convective laminar air flow inside a channel equipped with multiple power electronic devices cooled by MFHS. MFHS consist of three plate fin heat sinks which are made of aluminum foam with a porosity of 0.95 and a permeability of 1.65  10 -7 m 2 , and the heat sink base is made of aluminum solid. Comsol software is used to solve the governing equations. Numerical results reveal that the thermal performance of MFHS is larger than that of a conventional heat sink and a clear channel under the same operating conditions, and the thermal behavior of electronic devices cooled by MFHS is stable and maintained at admissible temperatures. The validation of the numerical results shows perfect agreement with the experimental data with a maximum relative error of 3 %.