The influence of indium (In) and zinc oxide (ZnO) nanoparticles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point, wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nanoparticles affected the thickness value of the intermetallic layer, giving it a lower and more uniform distribution between the solder and copper substrate.