is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.