A twice wafer-transfer technique can be used to fabricate high-brightness p-side-up thin-film AlGaInP-based light-emitting diodes (LEDs) with an indium-tin oxide (ITO) transparent conductive layer directly deposited on a GaP window layer, without using postannealing. The ITO layer can be used to improve light extraction, which enhances light output power. The p-side-up thin-film AlGaInP LED with an ITO layer exhibited excellent performance stability (e.g., emission wavelength and output power) as the injection current increased. This stability can be attributed to the following factors: 1) Refractive index matching, performed by introducing ITO between the epoxy and the GaP window layer enhances light extraction; and 2) The ITO layer is used as the current spreading layer to reduce the thermal accumulation in the epilayers.
A twice wafer-transfer technique can be used to fabricate high-brightness p-side-up thin-film AlGaInP-based light-emitting diodes (LEDs) with an aluminum-doped zinc oxide (AZO) thin films transparent conductive layer deposited on a GaP window layer. The GaP window layer consist of the two different doping profile, the carbon doped Gap (GaP:C) window layer of 50 nm is on the top of Mg doped GaP window layer of 8 μm. The GaP:C window layer is used to improved the ohmic contact properties of GaP:C/AZO. The AZO with different cycle ratio of Zn:Al (15:1, 20:1 and 25:1) is deposited on GaP:C window layer as current spreading layer by atomic layer deposition. The AZO layer can be used to improve light extraction, which enhances light output power. The output power of p-side-up thin-film AlGaInP LED with an AZO layer of 20:1 cycle ratio has improved up to 19.2 % at injection current of 350 mA, as compared with that of LED without AZO film. The p-side-up thin-film AlGaInP LED with AZO current spreading layer exhibited excellent performance stability, the emission wavelength shift of p-side-up thin-film AlGaInP LED without and with AZO thin film(Zn:Al=20:1) are 17 nm and 3 nm under the injection current increased from 20 mA to 1000mA, respectively. This stability can be attributed to the following factors: 1) Refractive index matching, performed by introducing AZO thin film between the epoxy and the GaP window layer enhances light extraction; and 2) the favorable thermal dissipation of the silicon substrate reduces thermal degradation.
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