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2 Experimental Method 2. 1 Materials Copper plates (purity: >99.96%, size: 20 × 20 × 2 mm) and solder foils (SnAg3. 0 Cu 0.5, size: 10 × 12 × 0.07 mm) were used as samples for analyzing the oxide film and measuring the oxide film thickness. Solder foils (SnAg3. 0 Cu 0.5, size: 5 × 5 × 0.07 mm) and solder balls (SnAg3. 0 Cu 0.5, size:φ1.5 mm) were used for the evaluation of wettability. The rust preventive agent and working oil used during the processing of copper plates were completely removed by immersion and degreasing by ultrasonic waves (using 1-bromopropane). Both copper plates and solder foils were stored in air for six months or more after processing, and native oxide films were initially formed. Formic acid (KANTO CHEMICAL CO., INC.; special grade, purity: > 98%) was used as the reducing agent, and N2 gas (99.99% purity) was supplied using an N2 cylinder. CuO (purity 99.9%) and Cu2O (purity 99%) manufactured by Kojundo Chemical Laboratory Co., Ltd. were prepared as reference samples for electron energy loss spectroscopy (EELS). SnO (purity 99.5%) and SnO2 (purity 99.99%) were used as reference samples for X-ray photoelectron

Formic acid can be used as a hydrogen source for the hydrogenations of various aromatic carbonyl and nitrile compounds into their corresponding alcohols and amines using reusable heterogeneous Pd/carbon and Pd/Al2O3 catalysts, respectively, under additive-free and mild reaction conditions.