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Heat transfer between encapsulated PCM panels and air plays an important role in PCM-Air heat exchangers. A new design for the encapsulation panel was developed considering practical aspects such as the cost of production and ease of manufacturing, in addition to heat transfer and pressure drop. A number of encapsulated panel surfaces were first investigated via 3D CFD simulations and compared with an existing panel in use by a commercial PCM-Air heat exchanger manufacturer. After validation, 2D CFD simulations were carried out for 32 different geometries to select the most effective design, which was fabricated and tested in the laboratory. Laboratory parameters tested included heat transfer, pressure drop and melting/solidifying. The laboratory results confirmed the improvements of the new panel in comparison with the existing panel and a flat panel. It was found that the proposed design doubled the heat transfer, holds 13.7% more material and the fan can overcome the increased pressure drop.

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