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Balun has been widely used for microwave circuits for its balance properties. The development of highly integrated RF systems has put forward higher requirements for superior performance and miniaturization of the balun. A compact broadband millimeter wave (MMW) transformer balun based on through silicon via (TSV) technology is proposed in this letter. Compared with the traditional balun, the proposed balun impedance ratio is 4:1, and the use of hexagonal coil winding significantly reduces its area and improves its performance. It is shown that the proposed balun has a magnitude imbalance of 0.64dB and a phase imbalance of 2.5° at 81.5-93GHz. A return loss of greater than 15dB is obtained for the frequency band ranges from 82.1-88.6 GHz. Furthermore, the area of balun is only 0.201×0.29mm2 (0.2×0.29λg2).

This paper come up with a novel helical dual-band antenna that can be used in terahertz (THz) band applications. The antenna is fed by a redistribution layer (RDL), and the metal patch is formed on the top and bottom surfaces of the silicon dielectric substrate, which is connected by through-silicon via (TSV) to form a helical structure. At the same time, better impedance matching can be achieved by changing the shape of the ground plate to achieve dual-band characteristics. The simulation results presentation that the return loss of the antenna in 319GHz-339GHz and 373GHz-388GHz is less than -10db, and it has good axial radiation characteristics.

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