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The novel packaging approach glassPack is introduced as System-in-Package (SiP) technology. Wiring length can be reduced and integration density can be increased by stacking different assembled substrate layers and interconnecting them with one another resulting in 3D-SiP. Glass is an excellent material because of matched coefficient of thermal expansion (CTE) to silicon, high thermal load, dielectricity and high optical transparency over a wide wavelength range. Commercially available thin glass foils can be used as substrate material for electronic and optoelectronic modules. The goal of our ongoing development is making glass based packaging competitive with polymer based (e.g. chip-in-polymer) or silicon based packaging (e.g. silicon-through-via, stacked dies by wire bonding). Our work is focused on conductor trace and through-via realization as well as optical lightwave circuits integration using glass as substrate material. For through-vias in glass, holes were drilled in glass wafers by different laser technologies or etched using photosensitive glass and evaluated. Conductor traces and through-via interconnects were deposited on glass. Also, optical waveguide and fluidic channel integration in glass substrates were investigated. This paper presents the first demonstrator of our glass based packaging technology targeting sensor applications. Two silicon dies, a laser diode, two photodiodes and a fluidic-optical chip were mounted on a glass substrate and interconnected by 3D electrical wiring

Glass is a perfect substrate material for electrical and optical packaging. The integration concept to bridge board and chip level using thin glass substrates by lamination in between of PCB base material will be presented. Different thin glasses are commercial available and will be reviewed. Furthermore the paper reviews glass panel processing in the area of display and electro/optical packaging focusing on integration advantages for photonic packaging. Ion exchange technology for large panel processing to integrate high-performing optical waveguides will be demonstrated for multi-mode beam propagation. Based on glass based photonic system-in-package (SiP) which is done on wafer level the up scaling on panel size of those processes is discussed in detail and experimental results are presented

glassPack" will be introduced as a novel photonic packaging concept for a wide area of applications like high-speed electronic systems and sensors. The usage of thin glass foils with a thickness of some tens of microns as substrate and interconnection material will be discussed. Photonic packaging in such hybrid optoelectronic systems involves single packages, modules, and subsystems comprising at least one optoelectronic device, micro-optical element or optical interconnection. Thin glass is a commercially available and reliable material with high thermal resistance and excellent optical properties. Because glass is a well known material, many technologies like polishing, plating, etching and refractive index tuning are already known. In combination with newly developed integration technologies, a complete glass based package on wafer level can be realized. The main ideas of the "glassPack" concept are: selection of suitable glass foils as substrate material, realization of microsystem compatible structuring technologies like cutting, drilling and etching, integration of optical waveguides by ion-exchange for single-and multi-mode applications, implementation of optical interconnects between fibres and integrated waveguides by laser fusion, integration of electrical wires and feed throughs, assembly of electronic and optoelectronic components, and bonding of the thin glass foils to 3D-stacks. Furthermore, the integration of micro fluidic channels into a "glassPack" will be supported. A sensor module containing optical waveguides, fluidic channels, electrical wires and components like a laser, two photodiodes and two flip-chips will be presented to demonstrate the suitability of glass as a material for integrated microsystems.