Summary The epoxy composite hollow microspheres (ECHM) was prepared by single emulsion technique. Porofor Toluenesulfonyl hydrazide (TSH) 75 was used as blowing agent. Carbon black was used as filler for polyamide‐epoxy adduct matrix, which was reverted ratio of 1:2 epoxy to polyamide. The epoxy mixture (internal phase) was dropped and stirred into a heated corn oil (external phase) to form spherical droplets. These epoxy droplets underwent two simultaneous mechanisms of curing and foaming and became hollow microspheres. As expected, higher TSH content produced lower density of ECHM because of more expansion in ECHM. This fact was also evident from the size of hollow microspheres observed by using scanning electron microscope. In addition, high TSH content of 16 phr induced higher thermal properties of ECHM compared to those of ECHM using 8 phr and 12 phr TSH.

Summary Carbon black‐filled epoxy porous (CBEP) was fabricated by using single emulsion technique. Mixture of epoxy, polyamide hardener, sodium bicarbonate (as blowing agent) and carbon black (as conductive filler) was dropped into a heated corn oil at 160 °C (containing free of polyunsaturated fatty acids). The epoxy‐oil system was stirred at 1000 rpm for 1 hour. Because of the immiscibility of epoxy mixture and corn oil, droplets of epoxy mixture were formed. Initial epoxy droplets were broken into small droplets due to the applied shear (from stirring). Receiving heat from oil phase, the decomposition of sodium bicarbonate and the curing reaction of epoxy and polyamide occurred simultaneously so CBEP was formed. It was found that sodium bicarbonate exhibited a significant effect on the morphology, thermal and conductivity properties of CBEP. Increase of sodium bicarbonate's content from 4 phr to 12 phr could produce larger epoxy particle size in CBEP. However, CBEP using 20 phr of sodium bicarbonate's content had the lowest particle size. The content of 20 phr could induce an early and strong decomposition reaction in the initial epoxy droplets, which broke them into smaller size; hence the smaller particle size was obtained after curing. This fact was evident from the result of bulk density, where higher sodium bicarbonate content induced lower bulk density of CBEP. Furthermore, CBEP using higher sodium bicarbonate content also exhibited better electrical conductivity.