Copper MMCs reinforced with graphene, SiC and graphite flakes with varying mass fractions of 2.5, 5, and 7.5 wt% SiC, 2.5, 5, 7.5, and 10 wt% graphite and 0.2, 0.4, 0.6 and 0.8wt% graphene particles were fabricated through powder metallurgy route. The powder mixtures were blended and then compacted under a uniaxial pressure of 400MPa for both Cu-SiC and Cu-Gr composites and 600Mpa for Cu-Gn composites. Green compacts were sintered by microwave (MW) sintering process. MW sintering was performed at 950°C in open atmosphere with a heating rate of 25°C/min for all composites. Densification parameter (DP) was determined for all MMCs and a reduction in DP values were observed with an increase in weight percentage of reinforcement particles as a result of increase in porosity. Higher mass fractions of reinforcement particles in the Cu matrix tend to offer a diffusion barrier to copper atoms. Micro-structural analysis was performed using Optical and scanning electron microscope which revealed a homogeneous microstructure of all composites at low mass fractions of Sic, graphite and graphene. In order to detect the presence of any oxides of Cu and other elements, EDS analysis was carried out. Hardness data showed an increasing trend for Cu-SiC and Cu-Gn composites and a declining trend for Cu-Gr composites. Porosity has a significant effect on the electrical conductivity values of the composites.