Tin monosulfide (SnS) is a promising light-absorbing material with weak environmental constraints for application in thin film solar cells. In this paper, we present low-temperature atomic layer deposition (ALD) of high-purity SnS of both cubic and orthorhombic phases. Using tin­(II) 2,4-pentanedionate [Sn­(acac)2] and hydrogen sulfide (H2S) as precursors, controlled growth of the two polymorphs is achieved. Quartz crystal microbalance measurements are used to establish saturated conditions and show that the SnS ALD is self-limiting over temperatures from at least 80 to 160 °C. In this temperature window, a stable mass gain of 19 ng cm–2 cycle–1 is observed. The SnS thin film crystal structure and morphology undergo significant changes depending on the conditions. High-resolution transmission electron microscopy and X-ray diffraction demonstrate that fully saturated growth requires a large H2S dose and results in the cubic phase. Smaller H2S doses and higher temperatures favor the orthorhombic phase. The optical properties of the two polymorphs differ significantly, as demonstrated by spectroscopic ellipsometry. The orthorhombic phase displays a wide (0.3–0.4 eV) Urbach tail in the near-infrared region, ascribed to its nanoscale structural disorder and/or to sulfur vacancy-induced gap states. In contrast, the cubic phase is smooth and void-free and shows a well-defined, direct forbidden-type bandgap of 1.64 eV.

Porous GaN crystals have been successfully grown and electrically contacted simultaneously on Pt- and Au-coated silicon substrates as porous crystals and as porous layers. By the direct reaction of metallic Ga and NH(3) gas through chemical vapor deposition, intermetallic metal-Ga alloys form at the GaN-metal interface, allowing vapor-solid-solid seeding and subsequent growth of porous GaN. Current-voltage and capacitance-voltage measurements confirm that the intermetallic seed layers prevent interface oxidation and give a high-quality reduced workfunction contact that allows exceptionally low contact resistivities. Additionally, the simultaneous formation of a lower workfunction intermetallic permits ohmic electron transport to n-type GaN grown using high workfunction metals that best catalyze the formation of porous GaN layers and may be employed to seed and ohmically contact a range of III-N compounds and alloys for broadband absorption and emission.

Introduction

Herein, the effect of the initial copper content of co‐evaporated Cu(In1−x,Gax)Se2 (CIGS) absorber films on the impact of a post‐annealing step in elemental sulfur atmosphere is studied. The Cu concentration is varied over a wide range ([Cu]/[III] = CGI = 0.57–1.23), allowing to identify composition‐dependent trends in phase formation, chemical rearrangements, and solar cell performance after sulfurization. For all samples, a ternary CuInS2 layer forms at the surface. In addition, sulfur 1) is incorporated in randomly distributed CuIn(S,Se)2 mixed crystals underneath CuInS2; 2) diffuses into multidimensional defects (e.g., dislocations and grain boundaries); and 3) is bound in Na–In–S surface plates. It is found that Cu‐poor absorber composition (CGI ≤ 0.82) favors CuInS2 growth as compared with close‐stoichiometric CIGS films, driven by a faster diffusion of Cu toward the surface. For Cu‐rich absorbers (CGI > 1), Se—S exchange is significantly accelerated, presumably by the presence of Cu2−xSe phases reacting to Cu2−xS and eventually catalyzing CuInS2 formation. Finally, open‐circuit voltage (VOC), fill factor (FF), and efficiency (η) of corresponding solar cells increase after sulfurization with increasing CGI until stoichiometry is reached. The result is explained by a mitigated Cu depletion of the absorber bulk after sulfurization for close‐stoichiometric CIGS.

LEDs with enhanced light extraction efficiency and sensors with improved sensitivity have been developed using porous semiconductors. Here, the growth of porous GaN epitaxial layers oriented along the [0001] crystallographic direction on Al 2 O 3 , SiC, AlN and GaN substrates is demonstrated. A lattice mismatch between the substrate and the porous GaN layer directly affects the structure and porosity of the porous GaN layer on each substrate. Deposition of unintentionally doped n-type porous GaN on non-porous p-type GaN layers allows for the fabrication of high quality rectifying p-n junctions, with potential applications in high brightness unencapsulated GaN-based light emitting diodes and high surface area wide band gap sensor devices.