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This paper describes the application of ASTEC3, a general purpose analogue electronic circuit simulation package, to the analysis of thermal properties of given structures. The modelling of each system is considered for both conduction and convection mechanisms, radiation being assumed to play a very minor role in heat dissipation from most electrical circuits. A procedure is given for the modelling of one-, two-and threedimensional thermal problems which is then used for the simulation of relatively simple examples. The results obtained with ASTEC3 are compared with results determined by using more traditional and independent techniques.

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