We have studied the optical properties (complex dielectric function) of bulk SrTiO3 and thin films on Si and Pt using spectroscopic ellipsometry over a very broad spectral range, starting at 0.03 eV [using Fourier transform infrared (FTIR) ellipsometry] to 8.7 eV. In the bulk crystals, we analyze the interband transitions in the spectra to determine the critical-point parameters. To interpret these transitions, we performed band structure calculations based on ab initio pseudopotentials within the local-density approximation. The dielectric function was also calculated within this framework and compared with our ellipsometry data. In the FTIR ellipsometry data, we notice a strong lattice absorption peak due to oxygen-related vibrations. Two longitudinal optic (LO) phonons were also identified. In SrTiO3 films on Si, the refractive index below the band gap decreases with decreasing thickness because of the increasing influence of the amorphous interfacial layer between the SrTiO3 film and the Si substrate. There is also a decrease in amplitude and an increase in broadening of the critical points with decreasing thickness. In SrTiO3 films on Pt, there is a strong correlation between the crystallinity and texture of the films (mostly aligned with the Pt pseudosubstrate) and the magnitude of the refractive index, the Urbach tail below the bulk band edge, and the critical-point parameters. FTIR reflectance measurements of SrTiO3 on Pt (reflection–absorption spectroscopy) show absorption peaks at the LO phonon energies, a typical manifestation of the Berreman effect for thin insulating films on a metal. The Urbach tail in our ellipsomety data and the broadening of the optical phonons in SrTiO3 on Pt are most likely caused by oxygen vacancy clusters.

Linear, paraelectric (Pb0.72La0.28)TiO3 or PLT(28) thin films with a bandgap>3 eV were deposited on Pt/Ti/SiO2/Si substrates by the sol-gel technique. Specific top-contact metals from two distinct groups (i.e., non-noble or M T and noble or M N; the former being oxidizable transition metals) were selected to understand the electrical nature of the interfaces in terms of electrode dependent energy band diagrams and equivalent circuit models. Using a high sensitivity high-pass filter circuit to evaluate the charging and discharging behavior coupled with results of the thickness and voltage dependence of capacitance, it was determined that M T ( Ni,Cr,Ti) and M N ( Pt,Au,Ag) metals form Ohmic and Schottky contacts, respectively. Supported by thermochemical data and calculations, the ohmic M T- PLT interfaces are envisioned to be of the form: M T-M T O x -n + PLT-n PLT. In contrast, the M N- PLT interfaces may be characterized by a metal work function independent Schottky diode; the surface Fermi level being pinned at the mid-gap. For example, a Schottky barrier height of 1.83 eV and a built-in voltage of 1.3 eV at the Pt-PLT interface were estimated. From low field capacitance measurements, the ratio of interfacial to bulk resistance, R i/R b, was estimated to be 23.

The current trend in electronic-systems technology is to produce compact, lighter, low-power-dissipating, affordable, reliable, and mobile information systems. These factors favor the augmentation of interface systems that sense, source, store, display, and actuate with artificial-intelligence strategies. Herein lies the opportunity to introduce novel technologies based on integrated multi-component oxide (e.g., titanates, niobates, and tantalates) films into usable systems. In particular the oxygen octahedra class of materials (e.g., (Ba,Sr)TiO3 or BST, Pb(Zr,Ti)O3 or PZT, layered SrBi2Ta2O9 or SBT, and polytitanates) that exhibit high permittivities; large electromechanical-coupling coefficients; and pyroelectric, electro-optic, and ferroelectric effects are of interest. They are being evaluated, due to growing demand for compatibility with integrated-circuit (IC) technology, for a variety of applications. These include nonvolatile memories, ultralargescale-integration (ULSI) dynamic random-access memories (DRAMs), decoupling capacitors, piezoelectric sensors and actuators, pyroelectric detectors, and neural network components. Moreover in high-performance multichip-module (MCM) technology, there remains a vital need for the replacement of discrete passive devices, which occupy valuable real estate, by embedded ones. These high-density interconnect structures will play a significant role in nondigital electronic modules including mixed-mode circuits, power conversion and conditioning, microwave transmit/receive (T/R), and optoelectronics. Table I specifically illustrates some electronic applications along with their estimated requirements.

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(Ba, Sr)TiO 3 (BST) thin films have been grown on planar Ir/Si and Pt/Si substrates and on three-dimensional (3D) Ir electrodes by metalorganic chemical vapor deposition using two kinds of β-diketonate-based BST precursors. Film growth was studied as a function of film thickness, composition, and substrate temperature. Growth rate was monitored by in situ spectroscopic ellipsometry. The BST films were characterized ex situ by a variety of techniques including x-ray photoelectron spectroscopy, Auger electron microscopy, atomic force microscopy, transmission and scanning electron microscopy, x-ray diffraction, and impedance analyzer. The results reveal that the two sets of BST precursors, albeit slightly different, show quite different reactivities that strongly affect the step coverage on the 3D structure. However, different reactivities have no apparent effect on the microstructure, surface morphology, and dielectric properties of the stoichiometric BST films. These properties strongly depend on the film composition, substrate material, and growth temperature. In general, the BST films grown on Pt exhibit better crystalline quality, surface smoothness, and dielectric properties compared to those grown on Ir under the optimal growth conditions.