No abstract

The improvement of heat conduction in any electronic devices has become a predominant issue in which effective heat dissipation is crucial to enhance the performance of packaged devices. This paper elucidates the application of thermally conductive particles filled composites as thermal interface material for LEDs. Present work aims on reducing the junction temperature and thermal resistance of the device under test with heavily filled ceramic-epoxy composite as the interface material between the device and metal substrate. Silane treated aluminium nitride (AlN) powder was studied for its feasibility as the filler material. The thermal conductivity values obtained by hot disc method (ISO/DIS 22007-2.2) were 0.66, 0.54 and 0.44 W/mK for 60, 50 and 40 wt% AlN filled epoxy composites respectively which were described well by thermal transient measurement of LEDs. The junction temperature and total thermal resistance of the thermal set up was reduced significantly with increased filler loading. The least junction to ambient thermal resistance (R thJ-A ) was achieved for 60 wt% followed by 50 and 40 wt% AlN filled TIM with the values of 24.8, 31.98 and 34.64 K/W respectively. Characteristics of the AlN filled composites for LED applications are discussed extensively in terms of thermogravimetric and thermo-mechanical analysis.

No abstract

No abstract

Al2O3powder with various particle sizes was prepared by milling process and mixed together with epoxy resin in order to increase the thermal conductivity of resin and decrease the junction temperature of the LEDs. Al2O3 powder filled epoxy resin was applied as thermal interface material (TIM) for an effective system level analysis of thermal transient measurement. The result depicted that the milled Al2O3 powder for 3 hour powder showed the highest thermal conductivity and hence lower in thermal resistance of LED. Moreover, the driving currents also influence the thermal resistance and achieved low thermal resistance when measured at 350mA. The thermal properties of the sample were tested using t3ster. The surface morphology of the samples was tested using FESEM.