InGaN-based blue-violet laser diodes (LDs) suffer from electron leakage into the p-type regions, which could be only partially alleviated by employing the electron blocking layer (EBL). Here, a thin undoped InGaN interlayer prior to EBL is proposed to create an additional forbidden energy range above the natural conduction band edge, which further suppresses the electron leakage and thus improve the characteristics of LDs. Numerical device simulations reveal that when the proper composition and thickness of InGaN interlayer are chosen, the electron leakage could be efficiently eliminated without inducing any severe accumulation of electrons at the interlayer, resulting in a maximum output power of the device.

The effect of oxygen on ambient gas on activating p-GaN by rapid thermal annealing was investigated. When the ratio of N 2 to O 2 is 4:1, the sample activated after annealing at 750 • C exhibits the best electrical properties with respect to resistivity. It is confirmed that the concentration of hydrogen which passivates Mg acceptors in GaN decreases more efficiently when oxygen is introduced into N 2 ambient gas. Although oxygen-involved annealing at higher temperature may further reduce the concentration of hydrogen, the resistivity of p-GaN may increase due to the negative effect caused by too much incorporation of oxygen-related donors.

The growth condition of thin heavily Mg-doped GaN capping layer and its effect on ohmic contact formation of p-type GaN were investigated. It is confirmed that the excessive Mg doping can effectively enhance the Ni/Au contact to p-GaN after annealing at 550 • C. When the flow rate ratio between Mg and Ga gas sources is 6.4% and the layer width is 25 nm, the capping layer grown at 850 • C exhibits the best ohmic contact properties with respect to the specific contact resistivity (ρ c ). This temperature is much lower than the conventional growth temperature of Mg-doped GaN, suggesting that the deep-level-defect induced band may play an important role in the conduction of capping layer.