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Paper deals with results ofsolderability testing. The importance ofsolderability testing grows up with implementing ofleadfree technology. Different properties ofleadfree solders, which replace SnPb solders, arefirst reason. Lead is also contained in surfacefinishes on component leads or printed circuit boards. Therefore the lead displacement in electronics assembly needs changes in surfacefinishes too. Lead has to be removedfrom surface layers ofboth component leads andprinted circuit boards (PCB). In practice there are several types ofleadfree surfacefinishes. New surfacefinishes are second reasonfor solderability testing. Paper willpresent the comparison of individual lead-free possibilities. The solderability ofseveral surfacefinish types was tested. Experiment was composed ofresistor (1206) lead testing and ofPCB coupon testing. The environment can affect the solderability ofsurface. That is why the solderability was measured before and after ageing. The results after aging will be presented in paper too.

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