A study of V/Al/Pt/Au and Ti/Al/Pt/Au contacts to n-Al0.3Ga0.7N/GaN heterostructures is presented. Vanadium was chosen as a potential replacement for Ti because V is expected to form a thermally stable nitride with a low work function. Low-resistance Ohmic contacts are achieved with V/Al/Pt/Au layers after annealing at 650 °C, which represents a decrease of 150 °C compared to the Ti/Al/Pt/Au counterpart. This contact exhibits two orders of magnitude lower specific contact resistance compared to the Ti/Al/Pt/Au contacts studied in this work when annealed at temperatures less than 800 °C, although the specific contact resistance of the Ti/Al/Pt/Au contacts is lower when annealed at higher temperatures. A contact resistance and specific contact resistance of 0.8±0.1 Ω mm and (1.4±0.3)×10−5 Ω cm2, respectively, are obtained after annealing at 650 °C for 45 s.