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A non weldable nickel-based superalloy was fabricated by powder bed-based selective electron beam melting (S-EBM). The as-built samples exhibit a heterogeneous microstructure along the build direction. A gradient of columnar grain size as well as a significant gradient in the γ' precipitate size were found along the build direction. Microstructural defects such as gas porosity inherited from the powders, shrinkage pores and cracks inherited from the S-EBM process were identified. The origins of those defects are discussed with a particular emphasis on crack formation. Cracks were consistently found to propagate intergranular and the effect of crystallographic misorientation on the cracking behavior was investigated. A clear correlation was identified between cracks and high angle grain boundaries (HAGB). The cracks were classified as hot cracks based on the observation of the fracture surface of microtensile specimens machined from as-built S-EBM samples. The conditions required to trigger hot cracking, namely, presence of a liquid film during the last stage of solidification and thermal stresses are discussed within the framework of additive manufacturing. Understanding the cracking mechanism enables to provide guidelines to obtain crack-free specimens of non-weldable Ni-based superalloys produced by S-EBM.

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There are still debates regarding the mechanisms that lead to hot cracking in parts build by additive manufacturing (AM) of non-weldable nickel-based superalloys. This lack of in-depth understanding of the root causes of hot cracking is an impediment to designing engineering parts for safety-critical applications. Here, we deploy a near-atomic-scale approach to investigate the details of the compositional decoration of grain boundaries in the coarse-grained, columnar microstructure in parts built from a non-weldable nickel-based superalloy by selective electron-beam melting. The progressive enrichment in Cr, Mo and B at grain boundaries over the course of the AM-typical successive solidification and remelting events, accompanied by solid-state diffusion, causes grain boundary segregation induced liquation. This observation is consistent with thermodynamic calculations. We demonstrate that by adjusting build parameters to obtain a fine-grained equiaxed or a columnar microstructure with grain width smaller than 100 μm enables to avoid cracking, despite strong grain boundary segregation. We find that the spread of critical solutes to a higher total interfacial area, combined with lower thermal stresses, helps to suppress interfacial liquation.