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Note: Laser ablation technique for electrically contacting a buried implant layer in single crystal diamond Rev. Sci. Instrum. 82, 056105 (2011); 10.1063/1.3595678 Microstructuring using femtosecond pulsed laser ablationUsing laser beam machining with ultrashort laser pulses, microstructures in the micrometer region can be manufactured in virtually all materials, regardless of their mechanical properties. However, machining times are slow if good surface qualities are required. Micro electrical discharge machining ͑EDM͒ is also capable of removing material nearly without process forces, but with a higher processing speed if structure sizes exceed a certain value. With the combination of both processes, specific advantages can be realized while disadvantages can be partially eliminated. Therefore, a hybrid machine tool was developed that combines the two processes of ultrashort pulsed laser ablation and EDM milling. No reclamping is necessary. In this study, the limitations and challenges of the single processes are investigated. After that, the novel hybrid machine tool is presented, along with strategies for the efficient and economic manufacturing of microstructures in materials that are difficult to machine by conventional processes.

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Modern ultra‐short‐pulse (USP) laser systems are fostering new micro‐machining technologies. Hole drilling with high aspect ratios has become a particularly important application in several industries. But drilling straight walls with high aspect ratios is not feasible if the laser beam impacts specimens at a normal incidence angle. The beam caustic affects hole corners and limits the maximum aspect ratio — that's why new solutions are needed. A novel 5‐axis technology allows beam inclination and enables straight walls, as well as negatively tapered holes.

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