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Abstract:We present a comparison of three different technologies for the fabrication of microoptical elements with arbitrary surfaces. We used direct laser writing, binary mask lithography in combination with reactive ion etching, and graytone lithography.

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The future demands for flat panel display (FPD) manufacturing is a resolution of 3-5 μm for large substrates of 550 × 650 mm2 size. Standard lithographic techniques, like wafer stepping or proximity printing can be used. Unfortunately, these methods have some severe drawbacks which significantly increase the fabrication costs. Using a wafer stepper, the small printing area will cause numerous exposure steps. The stepping has to be very accurate, because stitching errors can be easily seen in the display pattern. Using a proximity printer, the substrate is set some 20-50 μm behind the mask to achieve a resolution of 3-5 μm. This is not an easy task for large substrates. The costs for these highly planar substrates are immense. A direct contact may easily damage the expensive photomask.