Electrical discharge micromachining (micro-EDM) is an ideal process for obtaining burr-free machined micron-size apertures. Molybdenum is one of the most attractive high energy and power aperture materials due to its mechanical and physical properties, mainly its high melting temperature and relatively high thermal conductivity. In this paper, fundamental machining characteristics for micro-EDM of molybdenum were investigated both numerically and experimentally. A thermo-numerical model was created to simulate a single spark discharge process. Experimental crater size is investigated using scanning electron microscopy and optical evaluation methods. The effects of important EDM parameters such as the pulse duration on crater shape, temperature distribution, tool wear percentage, and eroded volume were studied. Correlations between numerical and experimental data are also discussed. The model effectively estimates the size of single spark craters in molybdenum. The results show that the developed thermo-numerical model can be an effective tool in predicting the size of a crater formed by a single spark discharge in the micro-EDM process.

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to assess the unique needs educators have for rapid prototyping of microelectronic systems and to suggest potential solutions for continuously improving the state-of-the-art in U.S. universities. The following vision statement was adopted: Educate students who can use the paradigm of design, simulate, design-for-test, build and test (as opposed to just design, build and test) to create microelectronic systems, not just integrated circuits tiCs), of sufficient quality that the global competitiveness of U.S. industry will be continued and enhanced.From this statement a number of findings and recommendations were made. Some of these include:(1) Student projects should be simulated thoroughly prior to submission to MOSIS for fabrication. (2) The use of Field-Programmable Gate Arrays (FPGAs) to support logic design and systems-oriented courses should be encouraged.(3) Fabrication services provided by MOSIS should be used largely for designs in which some portion has been performed manually. (4) NSF support for advanced classes should be broadened to include not only IC fabrication via MOSIS but also the acquistion of prototyping boards or multi-chip modules (MCMs) (5) Remote access via the Internet to expensive testers and prototyping systems should be made available. (6) MOSIS should add the following services: BiCMOS process, microelectro-mechanical post-processing, optoelectronic device fabrication and MCM prototyping. (7) A national clearinghouse should be supported to provide ready access by the educational community to existing and rapidly emerging resources that are presently dispersed. (8) Conferences, faculty enhancement short courses and newsletters should be supported to encourage widespread exchange of information.19 What design methodologies are appropriate?

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