We present an innovative rotational MEMS mirror that can control the direction of propagation of light beams inside of planar waveguides implemented in silicon photonics. Potential applications include but are not limited to optical telecommunications, medical imaging, scan and spectrometry. The mirror has a half-cylinder shape with a radius of 300 µm that provides low and constant optical losses over the full angular displacement range. A circular comb drive structure is anchored such that it allows free or latched rotation experimentally demonstrated over 8.5° (X-Y planar rotational movement) using 290V electrostatic actuation. The entire MEMS structure was implemented using the MEMSCAP SOIMUMPs process. The center of the anchor beam is designed to be the approximate rotation point of the circular comb drive to counter the rotation offset of the mirror displacement. A mechanical characterization of the MEMS mirror is presented. The latching mechanism provides up to 20 different angular locking positions allowing the mirror to counter any resonance or vibration effects and it is actuated with an electrostatic linear comb drive. An innovative gap closing structure was designed to reduce optical propagation losses due to beam divergence in the interstitial space between the mirror and the planar waveguide. The gap closing structure is also electrostatically actuated and includes two side stoppers to prevent stiction.

This work presents a laterally rotating micromachined platform integrated under optical waveguides to control the in-plane propagation direction of light within a die to select one of multiple outputs. The platform is designed to exhibit low constant optical losses throughout the motion range and is actuated electrostatically using an optimized circular comb drive. An angular motion of ±9.5° using 180 V is demonstrated. To minimize the optical losses between the moving and fixed parts, a gap-closing mechanism is implemented to reduce the initial air gap to submicron values. A latch structure is implemented to hold the platform in place with a resolution of 0.25° over the entire motion range. The platform was integrated with silicon nitride waveguides to create a crossbar switch and preliminary optical measurements are reported. In the bar state, the loss was measured to be 14.8 dB with the gap closed whereas in the cross state it was 12.2 dB. To the authors’ knowledge, this is the first optical switch based on a rotating microelectromechanical device with integrated silicon nitride waveguides reported to date.

A bio-inspired robotic brain is presented where the same spiking neural network (SNN) can implement five variations of learning by conditioning (LC): classical conditioning (CC), and operant conditioning (OC) with positive/negative reinforcement/punishment. In all cases, the links between input stimuli, output actions, reinforcements and punishments are strengthened depending on the stability of the delays between them. To account for the parallel processing nature of neural networks, the SNN is implemented on a field-programmable gate array (FPGA), and the neural delays are extracted via an adaptation of the synapto-dendritic kernel adapting neuron (SKAN) model, for a low resource demanding FPGA implementation of the SNN. A custom robotic platform successfully tested the ability of the proposed architecture to implement the five LC behaviors. Hence, this work contributes to the engineering field by proposing a scalable low resource demanding architecture for adaptive systems, and the cognitive field by suggesting that both CC and OC can be modeled as a single cognitive architecture.

No abstract

This work presents a novel die-level post-processing technique for dies including released movable structures. The procedure was applied to microelectromechanical systems (MEMS) chips that were fabricated in a commercial process, SOIMUMPs from MEMSCAP. It allows the performance of a clean DRIE etch of sidewalls on the diced chips enabling the optical testing of the pre-released MEMS mirrors through the chip edges. The etched patterns are defined by photolithography using photoresist spray coating. The photoresist thickness is tuned to create photoresist bridges over the pre-released gaps, protecting the released structures during subsequent wet processing steps. Then, the chips are subject to a sequence of wet and dry etching steps prior to dry photoresist removal in O2 plasma. Processed micromirrors were tested and found to rotate similarly to devices without processing, demonstrating that the post-processing procedure does not affect the mechanical performance of the devices significantly.