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In this paper, to study the output capacity of the micro detonator in MEMS flyer initiation sequence, we studied the driving Ti flyer process of micro detonator filled with “in‐situ” synthetic copper azide micro charge by combining experimental test, thermodynamic calculation, and hydrodynamic simulation. On the one hand, the flight process of the flyer is tested by an all‐fiber photonic Doppler velocimeter (AFPDV), and a complete flyer velocity curve is obtained. On this basis, the effects of different micro charge thickness, micro charge density, and accelerating chamber length on the flight process of the flyer are studied and analyzed. Thus, valuable experimental data are provided for the research of related micro detonators. On the other hand, we study the simulation of the copper azide micro charge driving flyer process. Firstly, we use the detonation thermodynamic program to calculate and fit the detonation velocity (D), detonation CJ pressure (PCJ), and JWL equation of state (EOS) parameters of detonation products of copper azide for simulation. For the gaseous detonation product, we compared the effects of three virial EOS: VLW EOS, VHL EOS, and VPL EOS on the calculation values of detonation parameters for copper azide. For the solid detonation product, a new EOS that can accurately describe the high temperature and high‐pressure state of copper was introduced to the program. Using the detonation parameters of copper azide calculated by thermodynamics, the process of driving the Ti flyer by micro charge is simulated by the 2D ALE method and compared with the experimental data under corresponding conditions.

Hollow copper microspheres with pore size about 3 μm and spherical shell around 150 nm were successfully prepared by electroless plating using polystyrene (PS) as sacrificial templates and the kinetics were studied concerning the empirical rate law. The effects of plating bath composition on the amount, microstructure and composition of the deposited copper shells were investigated. pH was the most important factor for copper deposition rate and amount of copper deposits. The amount of by-product Cu 2 O decreased with increasing pH values and the deposited copper agglomerated when pH value reached 13.41. The addition of stabilizers (2, 2-bipyridine, potassium ferrocyanide and methanol) had a very negative effect on the microstructure of the deposited copper shells. PS templates were removed by sintering and the remanent copper deposits with high purity maintained good spherical shell structure. In addition, the kinetic equation of electroless copper plating (ECP) using PS as the substrate was determined and the activation energy (E a ) was 59.77 kJ • mol −1 . The prepared hollow copper microspheres with high porosity are ideally suitable for synthesizing energetic materials and this method might also be used for fabricating other hollow metal microspheres.