Vertically aligned carbon nanotube (VA CNT) arrays are considered as promising thermal interface materials (TIMs) due to their superior out-of-plane thermal conductivities. However the air gaps between adjacent CNTs within the CNT array hinder the in-plane heat transfer, thus significantly degrading the thermal performance of VACNT-based TIMs. To improve the inter-tube in-plane thermal conduction within of VACNT arrays, we propose a novel three dimensional CNT (3D CNT) network structure, where the CNTs in a VACNT array are cross-linked by randomly-oriented secondary CNTs. Three different catalyst preparation methods for the secondary CNT growth are compared in terms of their ability to produce a dense network of secondary CNTs. Among the tested methods, the chemical impregnation method shows a denser 3D CNT network structure. The 3D CNT network grown using this method and is thus chosen for further thermal characterization via a framework especially developed for the evaluation of in-plane thermal properties of such devices. The temperature fields of the corresponding 3D CNT network under different heating powers are recorded using a 15 μm-resolution infrared thermal imaging system. The in-plane thermal conductivity is then derived from these fields using numerical fitting with a 3D heat diffusion model. We find that the in-plane thermal conductivity of the 3D CNT network is 5.40±0.92 W/mK, at least 30 times higher than the thermal conductivity of the primary VACNT array used to grow the 3D CNT network.

The reaction products between aluminum atoms and CO molecules in solid neon have been studied by matrix isolation infrared spectroscopy and quantum chemical calculations. Besides the previously reported AlCO and Al(CO) 2 molecules, new absorption at 1727.9 cm -1 was also produced and assigned to a dibridged Al 2 (CO) 2 molecule based on isotopic substitution experiments and theoretical frequency calculations. High level ab initio computations indicated that the Al 2 (CO) 2 molecule has a singlet ground state with D 2h symmetry. The molecule exhibits characteristics of aromaticity with two completely delocalized π electrons and an appreciable diatropic ring current.

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Carbon nanotubes (CNTs) are long considered as a promising material for thermal applications. However, problems such as low volume CNT fraction abhorrent to practical applications have been raising the demand for novel architecture of this material. Here we demonstrate two fabrication methods, in which a self-assembly method for fabricating covalent-bonded CNT network (3D CNT) and another method for covalent-bonded C to CNTs (C@CNT) network, and presented both as a potential method to enhance thermal conductivity of CNT arrays. We utilized pulsed photothermal reflectance technique and using new four-layer heat conduction model based on the transmission-line theory to measure thermal conductivity of the samples. The 3D CNT with thermal conductivity of 21 W mK−1 and C@CNT with thermal conductivity of 26 W mK−1 turn out to be an excellent candidate for thermal interface material as the thermal conductivity increased by 40% and 70% respectively as compared to conventional CNT arrays. The improvement is attributed to the efficient thermal routines constructed between CNTs and secondary CNTs in 3D CNT and between C layer and CNTs in C@CNT. The other factor to improve thermal conductivity of the samples is decreasing air volume fraction in CNT arrays. Our fabrication methods provide a simple method but effective way to fabricate 3D CNT and C@CNT and extend the possibility of CNTs towards TIM application.