Laser scanning based on Micro-Electro-Mechanical Systems (MEMS) scanners has become very attractive for biomedical endoscopic imaging, such as confocal microscopy or Optical Coherence Tomography (OCT). These scanners are required to be fast to achieve real-time image reconstruction while working at low actuation voltage to comply with medical standards. In this context, we report a 2-axis Micro-Electro-Mechanical Systems (MEMS) electrothermal micro-scannercapable of imaging large fields of view at high frame rates, e.g. from 10 to 80 frames per second. For this purpose, Lissajous scan parameters are chosen to provide the optimal image quality within the scanner capabilities and the sampling rate limit, resulting from the limited A-scan rate of typical swept-sources used for OCT. Images of 233 px × 203 px and 53 px × 53 px at 10 fps and 61 fps, respectively, are experimentally obtained and demonstrate the potential of this micro-scannerfor high definition and high frame rate endoscopic Lissajous imaging.

This paper introduces an optical 2-axis Micro Electro-Mechanical System (MEMS) micromirror actuated by a pair of electrothermal actuators and a set of passive torsion bars. The actuated element is a dual-reflective circular mirror plate of 1 normalmnormalm in diameter. This inner mirror plate is connected to a rigid frame via a pair of torsion bars in two diametrically opposite ends located on the rotation axis. A pair of electrothermal bimorphs generates a force onto the perpendicular free ends of the mirror plate in the same angular direction. An array of electrothermal bimorph cantilevers deflects the rigid frame around a working angle of 45∘ for side-view scan. The performed scans reach large mechanical angles of 32∘ for the frame and 22∘ for the in-frame mirror. We denote three resonant main modes, pure flexion of the frame at 205 Hz, a pure torsion of the mirror plate at 1.286 kHz and coupled mode of combined flexion and torsion at 1.588 kHz. The micro device was fabricated through successive stacks of materials onto a silicon-on-insulator wafer and the patterned deposition on the back-side of the dual-reflective mirror is achieved through a dry film photoresist photolithography process.

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