We report on the incorporation of gold into silicon at a peak concentration of 1.9 × 1020 at./cm3, four orders of magnitude above the equilibrium solubility limit, using pulsed laser melting of a thin film deposited on the silicon surface. We vary the film thickness and laser process parameters (fluence, number of shots) to quantify the range of concentrations that can be achieved. Our approach achieves gold concentrations comparable to those achieved with ion implantation followed by pulsed laser melting, in a layer with high crystalline quality. This approach offers an attractive alternative to ion implantation for forming high quality, high concentration layers of transition metals like gold in silicon.
We demonstrate that pulsed laser melting (PLM) of thin 1, 5, and 10 nm-thick vapor-deposited gold layers on silicon enhances its room-temperature sub-band gap infrared absorption, as in the case of ion-implanted and PLM-treated silicon. The former approach offers reduced fabrication complexity and avoids implantation-induced lattice damage compared to ion implantation and pulsed laser melting, while exhibiting comparable optical absorptance. We additionally observed strong broadband absorptance enhancement in PLM samples made using 5- and 10-nm-thick gold layers. Raman spectroscopy and Rutherford backscattering analysis indicate that such an enhancement could be explained by absorption by a metastable, disordered and gold-rich surface layer. The sheet resistance and the diode electrical characteristics further elucidate the role of gold-supersaturation in silicon, revealing the promise for future silicon-based infrared device applications.
The resolution of electrostatic force microscopy (EFM) is enhanced when multiwalled carbon nanotubes are used as extensions on conventional silicon cantilevers. Multiwalled nanotubes provide robust, high aspect ratio, conducting tips that minimize topographic dependence of gradients in the capacitance between the tip/cantilever and the substrate. Comparison of simultaneously acquired topographical and EFM images taken at the intersection of overlapping electrodes of electrically biased Al–Al2O3–Al tunnel junctions confirm the improved performance. This enhancement enables us to determine the surface contact potential differences between individual nanotubes within a bundle with resolutions of 5 mV and 10 nm.
Nanosecond pulsed laser melting can be used to rapidly recrystallize ion-implanted Si through liquid phase epitaxy. The rapid resolidification that follows the melting results in a supersaturation of impurities and hyperdopes the Si, inducing novel optoelectronic properties with a wide range of applications. In this work, structural changes in the Si lattice in Au-hyperdoped Si are studied in detail. Specifically, we show that the local skewing of the lattice observed previously in regions of extremely high Au concentrations (>1.4 at. %) can be related to the displacement of Au from perfect lattice positions. Surprisingly, although the incorporation of the larger Au atoms into Si is expected to cause swelling of the lattice, reciprocal space mapping shows that a small amount (0.3 at. %) of lattice contraction (decrease in lattice parameter) is present in the hyperdoped layer. Furthermore, positron annihilation spectroscopy shows an elevated concentration of vacancies in the hyperdoped layer. Based on these observations and with the aid of density functional theory, we propose a phenomenological model in which vacancies are kinetically trapped into lattice sites around substitutional Au atoms during resolidification. This vacancy trapping process is hypothesized to occur as a means to minimize lattice strain and may be universal in pulsed laser melted Si systems.
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