Recommendations for predicting heat transfer coefficients and critical heat fluxes are developed on the basis of available experimental data on heat transfer and critical heat fluxes for boiling of different liquids on microstructured surfaces realized by deformed cutting method. Microstructured surfaces allow intensifying heat transfer 1.1 to 6 times. Due to the variable wettability of microstructured surface elements, critical heat fluxes increase over 4 times. The proposed criteria equations allow predicting heat transfer coefficients with an error of 30%, and critical heat fluxes with an error of 30-35%. The equations are of interest for designing cooling systems for microelectronic devices, heat and mass transfer devices, boiling zones of heat pipes and thermosyphons, etc.

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Recommendations for prediction heat transfer coefficients and critical heat flux according to available in the literature experimental data of heat transfer and critical heat flux for boiling different liquids on microstructured surfaces made by deformed cutting method are obtained. In the work, on available in the literature sources of experimental data on heat transfer and critical heat flux at boiling of various liquids on the microstructured surfaces made by the deforming cutting method, recommendations for prediction of heat transfer coefficients and critical heat fluxes are received. Microstructured surfaces allow to intensify the heat transfer is 1.1 to 6 times. Due to the variable wettability of microstructured surfaces elements, critical heat flux increase before 4 times. The proposed criteria equations allow predicting heat transfer coefficients with an error of 30%, and critical heat fluxes with an error of 30-35%. In order to improve the accuracy of forecasting, the possibility of using an artificial neural network model for generalizing heat transfer coefficients is shown. Forecasting using an artificial neural network model allows us to determine the heat transfer coefficients with an error of ±20%.The equations are of interest for designing cooling systems for microelectronic devices, heat and mass transfer devices, boiling zones of heat pipes and thermosyphons, etc.