Ultrahigh-resolution three-dimensional images of a microscopic test object were made with soft x-rays collected with a scanning transmission x-ray microscope. The test object consisted of two different patterns of gold bars on silicon nitride windows that were separated by approximately 5 micrometers. Depth resolution comparable to the transverse resolution was achieved by recording nine two-dimensional images of the object at angles between -50 and +55 degrees with respect to the beam axis. The projections were then combined tomographically to form a three-dimensional image by means of an algorithm using an algebraic reconstruction technique. A transverse resolution of approximately 1000 angstroms was observed. Artifacts in the reconstruction limited the overall depth resolution to approximately 6000 angstroms; however, some features were clearly reconstructed with a depth resolution of approximately 1000 angstroms.

A double crystal x-ray monochromator system has been developed for use on synchrotron radiation sources. The system consists of two separate Bragg reflecting crystals constrained by a mechanical linkage system enabling it to tune continuously in x-ray energy, always maintaining an exit beam of constant offset and direction relative to the incident beam. Accurate parallelism between the two crystals is maintained by a piezoelectrically-controlled analog feedback circuit.

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Interdiffusion in the Ti/Rh/Au and Ti/Pt thin-film systems is measured using Rutherford backscattering. Extensive grain size measurements are used to interpret the data in terms of grain-boundary-assisted bulk diffusion. At room temperature, rapid grain-boundary diffusion of Au into the fine-grained Rh layer of the Ti-Rh-Au films occurs, characterized by a diffusion coefficient DB∼10−16 cm2/sec. The bulk diffusion of Au into the grains of the Rh film layer is examined using the grain-boundary-assisted bulk diffusion model, and the influence of surface segregation and size effects is discussed. It is found that interdiffusion in Ti-Rh and Ti-Pt couples is much slower than in Ti-Pd or Ti-Au. Methods are suggested by which the utility of Ti-Rh-Au as a conductor metallization might be improved.

High sensitivity actinic detection of native defects on extreme ultraviolet lithography mask blanks