No abstract

No abstract

No abstract

Abrasive Free Copper Chemical Mechanical Polishing (AF-CMP) was developed for Cu/low k materials. Blanket film Cu removal rate of 6000 Å/min with very less non-uniformity of 3% achieved for polishing pressure of 1.5 psi. CMP process window and lower critical pressure were identified with pattern wafers. Material removal mechanism was studied using surface morphology of Copper blanket wafers polished using different pressure, rotation rate and slurry flow rate. Material Removal Mechanism (wear mechanism) such as Chemical wear (etching) and mechanical wear (fatigue wear, particle adhesion wear and abrasion wear) have been found. The increase of slurry flow rate and relative velocity and the decrease of pressure give the dominance of chemical wear in material removal mechanism, and vice versa. Dishing control was achieved during Cu polish using different carrier/platen speed for Cu/SiLK™ patterned wafers. The cumulative distribution of the metal line-to-line leakage current measurements of wafers shows good performance and it is comparable to abrasive process.

The study focuses on the influence of SiC and heat treatment effect on mechanical and wear behavior of Aluminium Metal Matrix Composites (AMMCs), Al7075 is the matrix material and composites were prepared by varying the weight percentage of SiC. The prepared composites are divided into two groups Type A and Q samples while Type Q was artificially aged to T6 condition. In addition to the reinforcement, the hard intermetallic secondary phase that emerges due to heat treatment strengthens the AMMCs with a considerable degree of embrittlement. Both Type A and Q samples were characterized for various mechanical properties such as hardness, tensile strength, impact strength, etc. A new regression mathematical model was developed to predict the mechanical properties. Wear testing was done by varying load for a fixed distance and observed a good percentage of improvement in hardness, tensile strength, impact strength, and specific wear rate for 9% reinforced SiC AMMCs relative base alloy.