This paper introduces a reliability prediction model for plastic encapsulated integrated circuits to be used in professional or defence electronics applications. The first part is a comparison between different reliability prediction models: their hypotheses, assumptions and validity domains are examined; constructive criticism is made and model amendments proposed for plastic encapsulated ICs reliability prediction. The second part presents the model itself. It addresses also thermal and environmental aspects. The third part explains how numerical values are found to fill the model and how it reflects the reliability of today's state-of-the-art of plastic encapsulation. In conclusion, we present the improvements that this model can bring to reliability prediction, in the particular case of plastic packages.

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The content of this paper is based on the study published at ESREF 91 in Bordeaux under the title 'Plastic Encapsulated IC's in military equipments: reliability prediction modelling'. The first paper introduced the theoretical aspects of plastic encapsulated IC reliability prediction modelling. This paper presents the results of statistical studies done to complete the model with numerical data. Dependence of failure rates on year of manufacturing, dependence of thermo-mechanical failure rate on die diagonal, distribution of the quality of ICs in the market, and environment factor defect values are the principal topics addressed in this papcr.