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used in epoxy molding compounds all affect lead adhesion and resultant moisture performance. ConclusionsIn the past, the approach to solving the complex problem of plastic encapsulation for microelectronic devices has been one of trial and error. The semiconductor industry was relatively an infant industry and as such it addressed itself more toward solving the problems of design and fabrication of the active element than to the encapsulant. At the same time, the material supplier has been kept busy attempting to solve the rapidly changing requirements for moisture protection, temperature cycling and thermal stability in the materials. The semiconductor industry has now matured to the point that requirements have been well defined for the present and the future .This has necessitated a basic study, with the cooperation of the leading semiconductor manufacturers, which would allow a basic understanding of the rheological, mechanical, chemical and electrical properties of epoxy molding compounds and how these relate

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