The glass-passivated, face-down semiconductor chip joining technology employed in IBM's SLT (Solid Logic Technology), has become not only a fundamental element in the hybrid circuitry of System/360 but also the basis for later metallurgical designs.The "flip-chip," copper ball terminal, solder reflow technique is comprehensively reviewed and a discussion is given of its extension, through the use of ductile, all-solder terminals, to monolithic applications. P. A. Totta is at the IBM Components Division laboratory, East Fishkill, New York; R. P. Sopher is at the IBM Components Division laboratory.

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The preliminary work done by Westinghouse on properties of materials suitable for the in-pile testing facility was reviewed. Information was collected on a selected list of promising materials in the following classifications: alloy steels, chromium steels, precipitation-hardening stainless steels, and superalloys. On the basis of the information obtained from Westinghouse, from the literature survey, from Battelle files, and from visits to producers, it is recommended that Phase II of the program be confined to Inconel X hot rolled and aged, AM-350 subzero cooled and tempered, and Discaloy solution treated and aged. The future work necessary is detailed in a separate proposed research program. The process of making coextruded tubes developed by The Babcock & Wilcox Company appears promising for similar applications (where a high-strength outer layer is required in conjunction with a highly corrosion-resistant inner layer).

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