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This study focused on measuring the stress of TiN films prepared by rapid thermal processing, by sputtering, and by furnace annealing. Also included in the study were W and Al alloy films. The stress measurements were done at room temperature, and then further data were collected with temperature up to 870 °C for W and TiN. Al alloy films were temperature cycled up to 500 °C. Film structure was studied by transmission electron microscopy (TEM) analysis prior to and just after thermal cycling. Hysteresis curves were obtained for all films. Graphical stress temperature correlations were made for films of different thicknesses. TEM results of TiN films prepared by rapid thermal processing, furnace annealing, and sputter deposition, indicated a reduction in grain size along with an increase in the tensile stress upon completion of thermal cycling of the films.

The design and performance of a simple and efficient planar magnetron sputtering source using demountable targets are described. The design of the source enables sputtering of magnetic and nonmagnetic materials with equal ease.

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