Although the AlxGa1−xAs alloy system has been extensively investigated, there are still considerable uncertainties in measuring the value of x. Here a new AlxGa1−xAs calibration structure, grown by molecular beam epitaxy, has been used to establish unambiguous alloy compositions. Such “standard’’ AlxGa1−xAs layers were measured by high-resolution x-ray diffraction, photoluminescence, and Raman spectroscopy to determine the compositional variations of the measured physical parameters. The phenomenological equations derived from these measurements can now be used to establish the Al content of unknown alloys with confidence. In addition, the results show that Vegard’s law does not hold for the variation of the AlxGa1−xAs lattice constant with x. The small quadratic term has very important implications for a correct analysis of x-ray results.

We report results of a scanning spreading resistance microscopy ͑SSRM͒ and scanning capacitance microscopy ͑SCM͒ study of the distribution of charge carriers inside multi-quantum-well ͑MQW͒ buried heterostructure ͑BH͒ lasers. We demonstrate that individual quantum-well-barrier layers can be resolved using high-resolution SSRM. Calibrated SSRM and SCM measurements were performed on the MQW BH laser structure, by utilizing known InP dopant staircase samples to calibrate the instrumentation. Doping concentrations derived from SSRM and SCM measurements were compared with the nominal values of both p-and n-doped regions in the MQW BH lasers. For n-type materials, the accuracy was bias dependent with SSRM, while for SCM, excellent quantitative agreement between measured and nominal dopant values was obtained. The SSRM was able to measure the dopant concentration in the p-type materials with ϳ30% accuracy, but quantitative measurements could not be obtained with the SCM. Our results demonstrate the utility of combining calibrated SSRM and SCM to delineate quantitatively the transverse cross-sectional structure of complex two-dimensional devices such as MQW BH lasers, in which traditional one-dimensional probing using secondary ion mass spectroscopy provides only a partial picture of internal device structure.

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Two-dimensional carrier profiling using scanning spreading resistance microscopy (SSRM) has recently been reported for Si- and InP-based structures. In this article, we report SSRM measurements solely on III–V material-based structures. We have studied GaAs and InP doping staircase structures, prepared using molecular-beam epitaxy. These structures were then used as calibration standards for the profiling of carrier density in state-of-the-art III–V-based optoelectronic devices. We discovered that SSRM data on GaAs can be obtained with either polarity; however, only one polarity (positive or negative sample bias for n- or p-GaAs, respectively) produces SSRM results that show quantitative correlation with dopant concentration as determined by secondary ion mass spectrometry (SIMS). In comparison, SSRM measurements using both bias polarities on n-InP correlates well with SIMS, while p-InP exhibits a similar polarity dependence to p-type GaAs. A physical model based on a Schottky junction is proposed to explain these results. We also report calibrated SSRM measurements on GaAs and InP heterojunction bipolar transistor structures.

Two-dimensional (2D) carrier concentration profiling using scanning spreading resistance microscopy (SSRM) has been carried out on molecular beam epitaxy-grown GaAs and InP dopant calibration samples. The current transport mechanisms between the diamond-coated SSRM tip and the III–V semiconductor cleaved surface (110) was investigated as a function of semiconductor dopant concentration via current–voltage (I–V) measurement. A positive or negative tip bias was applied while scanning over each dopant concentration region (1016–1019 cm−3). The results were compared to simulated I–V curves based on thermionic emission theory. The best fits to the data obtained under forward bias indicated that the contact barrier heights, φb, were much lower than expected from conventional large area planar contacts to GaAs or InP. The effect increases with increasing doping concentration, as a result of a combination of barrier height lowering mechanisms such as image forces, thermionic field emission and minority carrier injection. Under reverse bias, the thermionic emission theory only holds for highly doped semiconductors while for low doping, surface and bulk generation currents determine the overall detectable SSRM current.