In this work, we applied two electromagnetic models for the characterization of a planar structure including a flat, thick copper conductor. Indeed the first model is consisted by modeling two metal ribbons without bulkiness, placed one above the other at a distance of h 2 equal to the thickness of the thick conductor. This approach has been implemented and tested by the iterative method. The results of simulations have been compared with those calculated by the Ansoft HFSS software, and they are in good concordance, validating the method of analysis used. The second model is based on the calculation of the effective permittivity of the medium containing the thick conductor. This medium consists of a metallic region of complex relative permittivity ′′  ε , the rest of this medium is filled with air ε r2 = 1. The effective permittivity ε eff calculated from these two relative permittivity ε r2 and ′′  ε. Comparing the simulation results of this new formulation of the iterative method with those calculated by the software Ansoft HFSS shows that they are in good matching which validates the second model.

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In most studies of microstrip circuits, the majority of researchers assume that the microstrip structures studied have flat metallic conductors of finite widths but without thickness. But in reality these types of structures integrate metallic copper conductors of different thicknesses. If we neglect this thickness we introduce error in the electrical parameters of the microstrip structure, which affects the effective permittivity, the characteristic impedance, the adaptation of the circuit, the resonance frequency, etc. Given the importance of this parameter (thickness of the metal of micro rubon structures), rigorous electromagnetic modeling of the thick micro rubon line based on the skin effect phenomenon (In fact at high frequency the skin effect phenomenon occurs and the current only flows on the periphery of the conductor) has been proposed to improve the studied electric model and ensure the increase in the precision of the analysis method used: Wave concept iterative process. The good agreement between the simulated and published data justifies the improvement of the model.

The skin effect is an electromagnetic phenomenon that makes the current flows only on the surface of the conductors at high frequency. This article is based on the phenomenon to model a structure made in coplanar technology. In reality, these types of structures integrated metal layers of different thickness of copper (9 μm, 18 μm, 35 μm, 70 μm). The neglect of this parameter introduces errors, sometimes significant, in the numerical calculations. This is why an iterative method (FWCIP) based on the wave concept was restated. Validation of results was carried out by comparison with those calculated by Ansoft HFSS software and Agilent ADS Technology. They show a good matching.