In this paper, a novel hollow substrate integrated waveguide (HSIW) is presented for realizing low-loss millimeter-wave (mm-wave) transmission lines embedded in multi-chip modules. A new analysis method for the HSIW is proposed by treating it as a combination of a two-dielectric loaded rectangular waveguide (RWG) and standard substrate integrated waveguide, where an effective dielectric constant, , is introduced. An HSIW prototype in the -band is fabricated using a progressive-lamination low-temperature co-fired ceramic technique. The measured results agree well with theoretical calculations and simulations. An average of 0.009-dB/mm loss is achieved in -band, which is comparable to an air-filled RWG. This shows that the technique has great potential for further development to realize highly integrated mm-wave modules.

In this communication, a double-sided Taylor-distribution dielectric resonator antenna array using dielectric insular image guide (DIIG) is presented. Analysis of the dielectric insular resonator antenna (DIRA) is performed with the effective dielectric constant (EDC) method, verified using HFSS™ simulations based on the finite element method (FEM). In order to enhance the gain, the DIRA array is made double-sided, i.e., a mirror image of the array is placed on the other side of the DIIG. The Taylor distribution technique is employed here to suppress the sidelobes. Finally, a 10-element linear DIRA array is fabricated and measured, and a high gain of 15.8 dBi at 36 GHz has been achieved.

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