With photoresist dot arrays fabricated by a two-beam interference lithography as an etch mask, two-dimensional (2-D) hexagonal aluminum-doped zinc oxide（AZO）submicron gratings (SMG) with 160nm height (h) and different periods (P) were produced using lift-off transfer process. Results show that as P decreased to 487nm, SMG exhibited excellent antireflection properties, which reduced the average total reflectivity (Rtotal) from 11.8% of AZO thin film to 4.7% in the wavelength range of 400nm-1050nm, and promoted the total transmittance (Ttotal) significantly, especially in the long spectral range of 750nm-1050nm. On the other hand, as P increased from 487nm to 985nm, the haze parameters of reflectance (HR) or transmittance (HT) improved from 25.5% to 40.2% or from 15.1% to 36.8%, respectively. Nevertheless, P increased from 985nm to 1435nm, both Rtotal (or Ttotal) and HR (or HT) varied very slightly. Bidirectional distribution functions at normal incidence not only verified that the larger the P was, the part of diffuse reflectance (or transmittance) were much higher, but also further demonstrate the larger the P, the smaller the diffaction angle. In summary, 2-D hexagonal AZO SMG show promising antireflection effects at P less than 487nm, and show promising scattering abilities at P about 985nm.

A new approach for manufacturing ultrathin free-standing polyimide film was proposed. This approach involves casting polyamic acid solution to a Al-doped zinc oxide film coated substrate sputtered at room temperature and to form polyamic acid film. The polyamic acid film was released from substrate in 0.5% diluted hydrochloric acid. Then polyamic acid was reattached to glass substrate and was transformed into polyimide film by thermal imidization with gradient heat treatment process. After that, thickness of the1000 nm polyimide film was reduced by KrF excimer laser ablation with 100 pulses at 45 mJ/cm2 and 30 pulses at 75 mJ/cm2, and 200 nm free-standing polyimide film was obtained. By this method, free-standing polyimide films of 1000 nm and 200 nm thickness were fabricated without and with excimer laser ablation reduction, respectively.

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