Lanonol phosphate was synthesized by a sustained-release phosphorylation reaction method using P 2 O 5 dispersed in lanonol phosphate. The phosphorylation reaction studies confirmed the best condition was a reaction temperature of 75°C, a reaction time of 2.5 h and a molar ratio of hydroxyl and P 2 O 5 of 3.0:1.0. The mole fraction of monoalkyl phosphate made by the sustained-release method increased by 14.3% compared to that obtained by the direct addition of P 2 O 5 . Preparation of lanonol phosphates by this method overcomes the agglomeration problem of phosphorus pentoxide, and the reaction rate is steady. Since lanonol phosphate was used as the dispersant for P 2 O 5 powder, impurities due to the presence of other dispersants were eliminated, allowing synthesis of a nearly pure product. A mixture of monoalkyl phosphate and dialkyl phosphate with high monoalkyl content is obtained with light color. It is an eco-friendly reaction with minimal waste.

In order to improve the adhesion and water resistance of waterborne polyurethane (WPU) adhesive, a kind of amino-terminated hyperbranched organosilicon (HPSi-NH2) was first synthesized by using trimethylchlorosilane, diethoxydimethylsilane, and γ-aminopropyltriethoxysilane (KH550) as raw materials. Then, HPSi-NH2, as the cross-linking agent, was used to modify the polyurethane prepolymer to obtain HPSi-NH2-modified WPU (HSiPU). The single-factor experiment results showed that when the amount of HPSi-NH2 was 2.0 wt %, the adhesion properties of HSiPU-2 were the best. Compared with the HSiPU-0 film, the water absorption rate of the HSiPU-2 film decreased by 10.9%, the water contact angle increased by 26.3°, the tensile strength increased by 10.1 MPa, and the elongation at break increased from 630.7 to 813.0%. HSiPU adhesive was used in the bonding of the goat leather substrate, and the results showed that the peel strength of leather bonded by HSiPU-2 was increased from 1.38 to 3.15 N/mm, and the maximum peel force was increased from 1.67 to 5.51 N/mm, which indicated that the bond strength of HSiPU adhesive with different contents of HPSi-NH2 can be used for bonding substrates with different cohesion strengths.