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The aim of this study is to highlight the key elements for optimizing printed circuit board (PCB) fabrication productivity through improving manufacturing process efficiency. Failure mode and effect analysis (FMEA) is a technique used to reduce the percentage of finished goods that are found to be defective during the manufacturing process and final inspection, resulting in low rejection ratios and optimized PCB design. This paper presents all the quality steps to achieve high efficiency in PCB design. The study is done in electronics manufacturing industry in which its production begins from receiving PCBs, raw material then bringing them into punching and assembly processes through surface mount machines (SMT). To find defective items and lower the possibility of defective final products, or IPQC (in-process quality control), is used. The average of customer manufacturers lot reject rate (%LRR of CMs) has been improved by using improved quality control. For assessing the risk connected to probable issues discovered during a failure mode and effects analysis, the risk priority number (RPN) methodology technique is applied. The FMEA RPN assists the responsible team or individual in prioritizing risks and choosing the appropriate remedial measures. Lot reject rate (LRR) improved by FMEA is from 5500 parts per million (PPM) to 900 parts per million (PPM), and faults have decreased by 0.76% as a result of improved quality control.

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A computationally efficient, integrated, and dynamic model has been developed for the design of a planar Slow Wave Structure (SWS) and beam-wave interaction analysis of a planar THz Traveling Wave Tube (TWT) with sheet beam. A Staggered Double Vane-Slow Wave Structure (SDV-SWS) is used for its numerous advantages over other types of SWSs. The integrated model determines RF performance of a planar TWT directly from the given beam voltage and center frequency by performing three different tasks, (i) determining geometrical parameters of an SDV-SWS of maximum possible bandwidth and high interaction impedance, (ii) determining RF circuit parameters of an SDV-SWS, and (iii) performing beam-wave interaction analysis of a planar TWT. The model was developed by adopting a numerically computing environment, MATLAB. Also, highly accurate numerical techniques with double precision were used, e.g., Sixth Order Runge Kutta Method was used for electron beam dynamic. The model was used to design and simulate a 0.22 THz Sheet Beam TWT of 100 W output power. The energy balance factor was achieved within ±0.001% over a very wide dynamic range from even 100 dB below saturation to more than 10 dB above saturation. The power growth of the forward wave achieves exactly 1 dB/dB. The program is fast enough for interactive use on a standard computer with a basic configuration. The model has been compared with the published works using a 3D electromagnetic field simulator for demonstrating its accuracy.