This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)), binary alloy (i.e., Aupalladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2Omega. Preliminary reliability testing indicates a 3times increase in switching lifetime when compared to microswitches with sputtered Au electric contacts. The ternary alloy exhibited approximately a 6times increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8Omega SECTION I. Introduction Microelectromechanical systems (MEMS) switches are paramount in importance for the future miniaturization of radio frequency (RF) systems. Space-based radar, phased array radar, and phase shifters all depend on reliable switching between RF loads. Because of their small geometries, exceptional RF performance, and low power consumption, MEMS contact switches are ideally suited for these applications. 1 The devices used in this study are illustrated in Fig. 1.

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