Microscopy is very important in research and industry, yet traditional optical microscopy suffers from the limited field-of-view (FOV) and depth-of-field (DOF) in high-resolution imaging. We demonstrate a simultaneous large FOV and DOF microscope imaging technology based on a chip-scale metalens device that is implemented by a SiN x metalens array with a co-and cross-polarization multiplexed dual-phase design and dispersive spectrum zoom effect. A 4-mm × 4-mm FOV is obtained with a resolution of 1.74 μm and DOF of 200 μm within a wavelength range of 450 to 510 nm, which definitely exceeds the performance of traditional microscopes with the same resolution. Moreover, it is realized in a miniaturized compact prototype, showing an overall advantage for portable and convenient microscope technology.
Topological defects are vital for tailoring soft matter properties and inspiring remarkable applications. Arbitrary guiding and dynamic tuning of director distributions are highly pursued in defect engineering of liquid crystals. Till now, the orientation control of smectic defect walls remains a challenge. Here, photoalignment is adopted to preset the surface anchoring in order to guide smectic oily streaks. Flexible defect engineering such as deflecting, bending, and splaying is demonstrated. Based on their combination, more complicated defect arrays are realized in a predictable manner. After electric stimuli involved, new functions of tunability and rotatability are unlocked. This work brings new insights to soft matter architectures, and will upgrade the existing micromachines, nanoparticle manipulations and advanced photonic applications.
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