We fabricate a 32 × 32 silicon photonics switch on a 300-mm silicon-on-insulator wafer by using our complementary metal-oxide-semiconductor pilot line equipped with an immersion ArF scanner and demonstrate an average fiber-to-fiber insertion loss of 10.8 dB with a standard deviation of 0.54 dB, and on-chip electric power consumption of 1.9 W. The insertion loss and the power consumption are approximately 1/60, and less than 1/4 of our previous results, respectively. These significant improvements are achieved by design and fabrication optimization of waveguides and intersections on the chip, and by employing a novel optical fiber connector based on extremely-high-Δ silica planarlightwave-circuit (PLC) technology. The minimum crosstalk was −26.6 dB at a wavelength of 1547 nm, and −20-dB crosstalk bandwidth was 3.5 nm. Furthermore, we demonstrate low-crosstalk bandwidth expansion by using output port exchanged element switches. We achieve a −20 dB crosstalk bandwidth of 14.2 nm, which is four-times wider than that of the conventional element switch based 32 × 32 switch.

A precise flip-chip bonding (FCB) technology for indium phosphide semiconductor optical amplifiers (InP-SOAs) on a silicon photonics platform within less than ±1-µm alignment accuracy was developed. For efficient optical coupling and a relaxed alignment tolerance, the mode field on both the InP-SOAs and the Si waveguides was expanded by spot-size converters (SSCs). On the InP-SOAs, width-tapered SSCs were used to obtain an isotropic mode-field having an approximately a 3-µm diameter. On the silicon photonics platform, dual-core SSCs were used to expand the same mode-field size of 3 µm as for the SSCs on SOAs. Using the FCB technology and the SSCs, an in-line optical amplification of 15 dB was achieved by in-line integrated SOAs with angled waveguides. The optical coupling losses were 7.7 dB, which included 5.1-dB excess losses by misalignment and a gap between InP-SOA and Si waveguides. A 4 × 4 Si switch with a hybrid-integrated 4-ch SOA array was fabricated, and achieved the first demonstration of a lossless Si switch.

Researchers experimentally demonstrate on-demand transfer of trapped photons on a photonic crystal chip for the first time.

No abstract

We fabricate and characterize a polarizationdiversity 32 × 32 silicon photonics switch by newly introducing SiN overpass waveguides onto our nonduplicate polarization-diversity path-independent insertion-loss switch. The SiN overpass waveguides are used to simplify the optical paths with a uniform path length between the edge couplers and the switch matrix and significantly reduce the number of waveguide intersections. The switch chip is fabricated using a 300-mm silicon-on-insulator wafer pilot line. The fabricated switch comprises more than 7,600 components, making this the largest ever complementary-metal-oxidesemiconductor-based silicon photonics circuit. The switch chip is electrically and optically packaged and evaluated for a sampled port connection with 32 paths, with an average on-chip loss of ∼35 dB and an average polarization-dependent loss of 3.2 dB where 75% of the measured paths exhibit a loss of less than 3 dB. The differential group delay is measured to be 1.7 ps. The performance can be further improved by optimizing the device design.