The metalorganic vapor phase epitaxy of coherent self-assembled InAs islands on InP(001) is demonstrated. Samples are characterized using transmission electron microscopy and photoluminescence (PL) spectroscopy at 77 K. The deposition of ∼2.4–4.8 monolayers (ML) of InAs at 500°C followed by a 30 s growth interruption results in the formation of coherent islands whose average diameter is 30–35 nm with a standard deviation of 8 nm and whose areal density is (3–4)×1010 cm−2. The PL emission is centered at 0.79 eV and has a full width at half maximum (FWHM) of 90 meV. When the nominal deposited thickness is increased to ∼9.6 ML, the average island diameter increases to ∼120 nm while the areal density decreases to ∼109 cm−2. The resulting PL is then centered at 0.83 eV with a FWHM of 130 meV and also displays a peak at 1.23 eV which is attributed to an InAs wetting layer ∼2 ML in thickness.

Epitaxial GaAs1−xNx alloy layers, nominally 200-nm-thick, with x up to 0.0375 were grown on GaAs(001) at temperatures Ts varying from 500 to 650 °C to investigate nitrogen incorporation and lattice parameter variations during organometallic vapor phase epitaxy from trimethylgallium, tertiarybutylarsine, and 1,1-dimethylhydrazine. Quantitative secondary ion mass spectrometry measurements (SIMS) indicate that N incorporation decreases systematically with increasing Ts to become almost negligible at 650 °C. All films are coherent with the substrate as judged by high-resolution x-ray reciprocal lattice mapping although atomic force microscopy and cross-sectional transmission electron microscopy reveal the presence of cracks in films with x>0.02. High-resolution x-ray diffraction measurements combined with SIMS analyses indicate that the lattice constant decreases linearly with increasing x following closely the predictions of Vegard’s rule for x<0.03. At higher concentrations, the lattice constant decreases more rapidly as a significant fraction of N atoms becomes incorporated in nonsubstitutional sites as demonstrated by nuclear reaction analysis.

We use photolithography to pattern molecularly imprinted polymers for the wafer-scale production of biochips. We are able to produce multiplexed, spatially resolved micrometer-sized features of functional materials capable of molecular recognition. Using a fluorescent probe, dansyl-L-Phe, we show specific analyte binding to MIP patterns imprinted with boc-L-Phe, by fluorescence microscopy. Advantages of this technique are the control of shape and size of the patterns with a resolution of 1.5 microm, and the possibility of depositing a number of different MIPs on the same chip (parallelization). Multiplexing chips on the same substrate paves the road to their mass-production. Because of the simplicity of the method and the low cost of chip fabrication, we believe that mass production of portable microbiochips based on stable MIPs is now in close reach. Their combination with integrated transducers fabricated by micromachining techniques appears also possible.

In this paper, we investigate the effects of non-ideal clamping shapes on the dynamic behavior of silicon nanocantilevers. We fabricated silicon nanocantilevers using silicon on insulator (SOI) wafers by employing stepper ultraviolet (UV) lithography, which permits a resolution of under 100 nm. The nanocantilevers were driven by electrostatic force inside a scanning electron microscope (SEM). Both lateral and out-of-plane resonance frequencies were visually detected with the SEM. Next, we discuss overhanging of the cantilever support and curvature at the clamping point in the silicon nanocantilevers, which generally arises in the fabrication process. We found that the fundamental out-of-plane frequency of a realistically clamped cantilever is always lower than that for a perfectly clamped cantilever, and depends on the cantilever width and the geometry of the clamping point structure. Using simulation with the finite-elements method, we demonstrate that this discrepancy is attributed to the particular geometry of the clamping point (non-zero joining curvatures and a flexible overhanging) that is obtained in the fabrication process. The influence of the material orthotropy is also investigated and is shown to be negligible.