The relative effectiveness of methods available for measuring the thickness of gold electrodeposits is reviewed; and the methods selected for aslessing deposits in electronic connectors discussed. Many factors influence the interpretation of results for gold electrodeposits, the most significant being deposit density and the factors which influence this are explored.The science of thickness measurement has advanced significantly in the past decade and measurement of precise areas on complex shaped components can now be carried out non-destructively and with reproducible results. This ease of measurement has led to increased control of process colts for the electroplater and more precise specification of work requirements from the designer/customer to the electroplater/subcontractor.Many factors can influence the quality and thickness of acid gold electrodeposits (1-3). With high value precious metals, such as gold, the need for control of tost and metal consumption is amplified and is the focus of attention for both platers and accountants (4). This can often lead to discussions between the electroplater and the customer on what is the exact thickness and whether it conforms to the original specification. This paper indicates the difficulties encountered in thickness measurement and highlights the factors which need to be considered when interpreting results. Particular attention is paid to the situation faced by the producer of gold plated electronic connectors not only in the actual process of thickness measurement but in the definition and control of specifications to maximize gold savings.

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How the metal finishing (plating) industry is meeting the technical demands of the Microelectronic market as the demand of smaller, lighter, faster, cheaper moves on relentlessly. This paper will focus in particular on Pure Gold Plating, Silver Plating and Palladium Plating for this market. Electrolytic, electroless and immersion processes will be covered outlining the operating parameters and defining applications in particular to the rapidly changing electronic packaging market within microelectronics. In this market the effects of contamination on the deposit compositions, e.g. comparing a Modern Pure Gold Plating bath with traditional Pure Gold Plating processes, can be significant and will be discussed in detail. Details on silver plating for LED applications will also be covered in this paper. How these products are moving towards more Environmentally Friendly low and non-cyanide systems will also be shown.

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