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Techniques of determining the performance of IC packages and sensitivity analysis of noise to package physical parameters in electronic systems are presented. Results are shown for noise characterization of various drivers on the packages and sensitivity of noise parameters to package design parameters. Using the techniques of noise characterization, package and I/O driver performance limits in the system can be evaluated. Using the techniques of sensitivity analysis, performance improvement of any changes in the package design can be e c t e d , and the package can be optimized during the design phase to satisfy electrical requirements of the system. 640569-5503/95/0000-0064 $3.00 O1995 IEEE

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The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing iruportance with higher circuit integration and system perfor1nanc.e. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, ('AD framework development and evaluations for performance, riianufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.