We systematically investigated the recovery ability of some silylation materials for a plasma-damaged porous silica low-k material. In order to evaluate recovery ability, the permittivity and leakage current were measured. The recovery ability is listed in ascending order as ethoxy group, disilazane group, and dimethylamino group, and materials with SiH-(CH 3 ) 2 showed a better recovery ability than those with Si-(CH 3 ) 3 . Recovery mechanisms were also analyzed using Fourier transform infrared spectroscopy (FT-IR) and thermal desorption spectrometer (TDS). Clear differences in the silylation abilities were observed in the silylation rate as well as the amount of silylation. We focused on trimethylsilyldimethylamine (TMSDMA) and tetramethyldisilazane (TMDS) as the recovery material of vapor phase and both materials showed good recovery characteristics. TMSDMA showed rapid recovery because of its higher vapor pressure. TMDS effectively reduced the amount of absorbed water.

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Using a test tool with sharp cutting edge, tool angle 30 and clearance angle 0 , the effect of the undeformed chip thickness on the cutting performance in modeled veneer cutting of sugi was investigated. The experimental conditions of nominal chip thickness were 0.13, 0.26, 0.45, 0.72, and 0.89 mm. The purpose of this study was to obtain the minimum chip thickness which could form the chip. The veneer cutting process consisted of cutting 1 with chip thickness of 0 to nominal chip thickness, cutting 2 with constant nominal chip thickness, cutting 3 with nominal chip thickness to chip thickness 0 and burnishing 4 with chip thickness 0. The cutting force, machined surface profile, tool feed and rotational angle of the work pieces were measured in all cutting processes. Changes of cutting force, frictional angle on the face, frictional angle on the back and cutting error were analyzed. In cutting 1 and cutting 3 , no chip was produced with the undeformed chip thickness when the frictional angle was larger than 90. The undeformed chip thickness at the frictional angle of 90 was the minimum chip thickness. In this experimental condition, the minimum chip thickness was about 0.2 mm regardless of nominal chip thickness. The burnishing force caused by the cutting tool pushed the remaining volume that could not be cut with chip thickness less than the minimum chip thickness.