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This paper presents a report of the state of the art with respect to the electromigration phenomenon in integrated circuit (IC) metallization. Reported here are some of the latest research efforts, including the authors' research, on the effects of dielectric overcoatings on electromigration in aluminum interconnections. This research has shown that dielectric overcoating of the aluminum stripes yields interconnections with greater mean time between failures than found in many conventional integrated circuits. ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 130.237.29.138 Downloaded on 2015-07-24 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 130.237.29.138 Downloaded on 2015-07-24 to IP

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