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A novel silicide formation technique using milli-second anneal is reported for the first time, delivering superior silicide film morphology that translates electrically into significant yield improvement over a conventional soak anneal, without any degradation of transistor performances. In addition, we demonstrate how this new technique enables the integration of thin silicides required for further junction scaling, and demonstrate up to 6nm gate length reduction and more than 1 decade junction leakage imporvement.

The effect of position of top metal contact on the electrical transport through individual multiwalled carbon nanotubes (MWNTs) has been investigated using gas injection system in situ in scanning electron microscope to deposit the top platinum metal contacts at different desired sites on the side contacted MWNTs in bridging structure. Current-voltage measurements reveal a significant improvement in electrical properties of the tubes after the top contact is made. This improvement has been found to be independent of position of top contact, i.e., whether the top contact is made on the ends or at any other site of the tube.

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