Improving the mechanical properties of polymeric materials has become necessary for the mechanical designer, especially by using nano materials due to easy and wide use. Therefore, in this research, silica nanoparticles (SiO2NPs) were used to improve the tensile, creep resistance, and hardness of epoxy. The volumetric ratios of SiO2NPs (0.5, 1, 1.5, and 2%) were mixed by using a magnetic starrier and ultrasound mixer then poured into a mold. The tensile, creep resistance, and hardness properties of the resulting composites were studied. The microstructure was investigated using a field emission scanning electron microscope (FESEM) and x-ray diffraction devices. The results showed that the best Young Modules and the ultimate stress were obtained at (1.5%) of SiO2NPs, while the best creep strain improvement was at (1%) of SiO2NPs. The SEM and X-ray diffraction results showed homogeneous silica nanostructures.

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