In today's traditional electronics such as in computers or in mobile phones, billions of high-performance, ultra-low-power devices are neatly integrated in extremely compact areas on rigid and brittle but low-cost bulk monocrystalline silicon (100) wafers. Ninety percent of global electronics are made up of silicon. Therefore, we have developed a generic low-cost regenerative batch fabrication process to transform such wafers full of devices into thin (5 μm), mechanically flexible, optically semitransparent silicon fabric with devices, then recycling the remaining wafer to generate multiple silicon fabric with chips and devices, ensuring low-cost and optimal utilization of the whole substrate. We show monocrystalline, amorphous, and polycrystalline silicon and silicon dioxide fabric, all from low-cost bulk silicon (100) wafers with the semiconductor industry's most advanced high-κ/metal gate stack based high-performance, ultra-low-power capacitors, field effect transistors, energy harvesters, and storage to emphasize the effectiveness and versatility of this process to transform traditional electronics into flexible and semitransparent ones for multipurpose applications.

P+IPW N+/NW -l r l r i 0 . 8 . 0 0 . ! f . *. 0 t -. " ' . ! ' . A 180 nm generation logic technology has been developed with high performance 140 nm L G A~ transistors, six layers of aluminum interconnects and low-& SiOF dielectrics. The transistors are optimized for a reduced 1.3-1.5 V operation to provide high performance and low power.The interconnects feature high aspect ratio metal lines for low resistance and fluorine doped SiOz inter-level dielectrics for reduced capacitance. 16 Mbit SRAMs with a 5.59 pm2 6-T cell size have been built on this technology as a yield and reliability test vehicle.

Micro/nano-electromechanical resonator-based logic elements have emerged recently as an attractive potential alternative to semiconductor electronics. The next step for this technology platform to make it into practical applications and to build complex computing operations beyond the fundamental logic gates is to develop cascadable logic units. Such units should produce outputs that can be used as inputs for the next logic units. Despite the recent developments in electromechanical computing, this requirement has remained elusive. Here, we demonstrate for the first time a conceptual framework for cascadable logic units. Cascadability is experimentally demonstrated through two case studies; one by cascading two OR logic gates. The other case is the universal NOR logic gate realized by cascading an OR and a NOT gate. The logic operations are performed by on-demand activation and deactivation of the second mode of vibration of a clamped-clamped microbeam resonator. We show that the demonstrated approach significantly lowers the complexity and number of microresonator-based logic functions compared to the CMOS-based counterparts, which improves energy efficiency. This can potentially lead toward the realization of a novel technology platform for an alternative computing paradigm.

Electronic chips that are commercially available today are durable and long lasting. However, there is a great need for electronic systems that can lose the functionality and struc ture on demand, or after a certain amount of time. Transient electronics is an emerging technology field in which the func tionality of a chip can be altered or completely destroyed in a controlled manner. [1][2][3][4][5][6] Application areas of transient electronics include healthcare where electronic monitoring implants that can be resorbed in the body over time or a network of bio degradable sensors distributed in the environment that can pro vide data for a certain amount of time. [1][2][3][4][5][6][7][8][9][10][11] In today's digital age, the increasing dependence on information also makes us vulnerable to potential invasion of privacy and cyber security. Consider a scenario in which a hard drive is stolen, lost, or misplaced, which contains secured and valuable information. In such a case, it is important to have the ability to remotely destroy the sensitive part of the device (e.g., memory or processor) if it is not possible to regain it. Many emerging materials and even some traditional materials like silicon, aluminum, zinc oxide, tungsten, and magnesium, which are often used for logic processor and memory, show promise to be gradually dissolved upon exposure of various liquid medium. However, often these wet processes are too slow, fully destructive, and require assistance from the liquid materials and their suitable availability at the time of need. This study shows Joule heating effect induced thermal expansion and stress gradient between thermally expandable advanced polymeric material and flexible bulk monocrystalline silicon (100) to destroy highperformance solid state electronics as needed and under 10 s. This study also shows different stimuli-assisted smartphone-operated remote destructions of such complementary metal oxide semiconductor electronics.

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